Soldering method
US5172852A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 1, 1992 |
| Grant date | Dec 22, 1992 |
| Priority date | — |
| Expiry date | May 1, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic component (14) is soldered to a circuit carrying substrate (11) by a method that allows the component to remain in better contact with the flat solder pads of the substrate. The circuit carrying substrate (11) has a plurality of solder pads (12) disposed thereon, each pad consisting of a terminal portion (16), a solder reservoir portion (18), and a bridging portion (17). The terminal portion is connected to the reservoir portion by the bridging portion. The bridging portion is typically a necked down portion of the pad. The electronic component (14) has a plurality of solderable terminals (15) corresponding to the terminal portions (16) of the solder pads (12). Each of the solder pad reservoir portions are coated with a reservoir of solder (23). The amount of solder coated onto the reservoir portion is sufficient to provide a fillet between the component (14) and the solder pad terminal portion (16) during a subsequent heating step. A flux (25) is then applied to the solder pad terminal portions (16), and the electronic component (14) is placed on the circuit carrying substrate so that each of component terminals is in the flux and contacts the terminal portions of th…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.