Process for electroplating metals
US5173170A · kind A · utility
17Cited by
7References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 1991 |
| Grant date | Dec 22, 1992 |
| Priority date | — |
| Expiry date | Jun 3, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating cell having soluble and insoluble anodes is provided with a primary power supply having a positive terminal connected to the soluble anodes and a negative terminal connected to a cathode including workpieces to be plated. An auxiliary power supply has a positive terminal connected to the insoluble anodes and a negative terminal connected to the negative terminal of the primary power supply so that the voltage applied to the insoluble anode is equal to the sum of the voltages applied by the two power supplies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.