Packaged SQUID system with integral superconducting shielding layer
US5173660A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 26, 1990 |
| Grant date | Dec 22, 1992 |
| Priority date | — |
| Expiry date | Dec 26, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S505/846
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A SQUID package includes a layered SQUID base and a SQUID mounted upon the base. The SQUID base is formed as a first substrate layer of an electrically insulating material, a shielding layer of a material that is superconducting at the SQUID operating temperature overlying the first substrate layer, and a second substrate layer of an electrically insulating material overlying the shielding layer. The shielding layer protects the SQUID from dc and ac interference such as magnetic and electrical fields, which would otherwise interfere with its operation. Related components such as input and output circuitry can be mounted on the base. An input coil used to detect magnetic fields can also be placed on the base, but in that case the shielding layer is made to cover only a portion of the SQUID base, and the input coil is positioned over the portion of the base that has no shielding layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.