Electronic packaging with varying height connectors
US5173763A · kind A · utility
8Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 11, 1991 |
| Grant date | Dec 22, 1992 |
| Priority date | — |
| Expiry date | Feb 11, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In joining conductors at different levels on a carrier to contact locations on a planar substrate, mound shaped connections are employed, with the height of each mound shaped connection extending to the level of the particular conductor to which it is bonded. The mound shaped connections are formed using planar processes of controlled volume deposition, surface tension shaping on reflow, and physical deformation. The height of the mound shaped connections are calculated empirically from the volume deposited bounded by the substrate pad after surface tension limits the slump on reflowing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.