Conductive adhesive and article made therewith
US5173765A · kind A · utility
22Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 1990 |
| Grant date | Dec 22, 1992 |
| Priority date | — |
| Expiry date | Nov 29, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A conductive adhesive for bonding semiconductor pellets to tabs is made from a conductive addition reaction-curing silicone rubber composition which contains.ltoreq.500 ppm of low-molecular-weight siloxane which has a vapor pressure.gtoreq.10 mmHg at 200.degree. C. The conductive adhesive can contain a metal micropowder such as gold, silver, nickel or copper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.