Molded IC card
US5173840A · kind A · utility
95Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 25, 1991 |
| Grant date | Dec 22, 1992 |
| Priority date | — |
| Expiry date | Apr 25, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0058
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An IC card includes a thin plate forming an external surface of the card, a circuit board formed on an internal surface of the thin plate, and a frame surrounding peripheries of the thin plate and the circuit board. A space defined by the frame and the surface plate is filled with molded resin. A portion of an inner peripheral surface of the frame projects into the resin. The molded resin completely covers a surface of the circuit board and integrates the frame and the thin plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.