Chip removal apparatus and method of using same
US5174016A · kind A · utility
9Cited by
10References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 25, 1991 |
| Grant date | Dec 29, 1992 |
| Priority date | — |
| Expiry date | Apr 25, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53274
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A chip removal method and apparatus for use with a robotic unit. The chip removal apparatus includes a heated center quill and a soldering unit which cooperate together with a chip removal tool for simultaneously disabling the bonding materials securing a chip to a printed circuit board. The method permits the fine pitch chip device to be removed from the printed circuit board substantially intact for subsequent testing purposes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.