Conductive ink composition and method of forming a conductive thick film pattern
US5174925A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 1991 |
| Grant date | Dec 29, 1992 |
| Priority date | — |
| Expiry date | Apr 11, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/22
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of forming a conductive thick film pattern comprises the steps of filling grooves of an intaglio with a conductive ink, transferring the conductive ink in the grooves onto a blanket of which surface is coated with an elastic material, transferring and printing a conductive thick film pattern transferred on the blanket onto a substrate, firing the conductive pattern to scatter the organic matter, and sintering the conductive pattern. A conductive ink comprises conductive metal powder, glass frit, transition metal oxide, dispersing agent, the vehicle containing an organic binder comprising at least one of poly-iso-butyl methacrylate, poly-iso-propyl methacrylate, polymethyl methacrylate, poly-4-fluoroethylene, and poly.alpha.-methyl styrene.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.