Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips
US5175613A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 1991 |
| Grant date | Dec 29, 1992 |
| Priority date | — |
| Expiry date | Jan 18, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package for integrated circuit chips, or other electrical devices, provides mechanical shock and thermal protection for the chips, and in addition, protects the chips from electromagnetic interference and electrostatic discharge. The package includes a printed wiring board base for reception of one or more circuit chips, and a conductive heat sink and cover. The conductive heat sink, in conjunction with a reference plane in the wiring board base, acts as an EMI shield for the chips. The heat sink is covered with an insulating layer, on top of which, a conductive coating is placed. The conductive coating is electrically connected to the reference plane, and the two act to protect the chips from electrostatic discharges. Compliant pads support the chips, and a thermally conductive elastomer can be placed on top of each chip between the chips and the inner top surface of the heat sink. The chips are thereby held securely in position, and are thermally connected to the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.