Lead frame for integrated circuits or the like and method of manufacture
US5176255A · kind A · utility
29Cited by
3References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 19, 1991 |
| Grant date | Jan 5, 1993 |
| Priority date | — |
| Expiry date | Jun 19, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame is provided having a number of leads to be mechanically and electrically connected to a substrate. Retaining members are also provided with the frame to hold the substrate against the leads. The retaining member is preferably disengaged from the substrate simultaneously with the trimming of the leads from the frame after connecting to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.