High speed wafer handling method
US5176493A · kind A · utility
8Cited by
10References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 1991 |
| Grant date | Jan 5, 1993 |
| Priority date | — |
| Expiry date | Dec 11, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention describes a loading system for high speed loading of wafers, such as semiconductor wafers, into vacuum chambers for various applications such as inspection or processing using, for example, a SEM. This system provides low contamination from atmospheric conditions both on loading and unloading the wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.