IC socket structure
US5176524A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 1991 |
| Grant date | Jan 5, 1993 |
| Priority date | — |
| Expiry date | Oct 17, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An IC socket structure suitable for supporting a surface-mount type of IC (integrated circuit) package includes an IC socket having electrical contacts disposed in corresponding relation to pins of the IC package, the electrical contacts being elastically held, a printed board on which a peripheral circuit associated with the IC package is disposed, the printed board having lands disposed in locations corresponding to the respective pins of the IC package and electrically connected to the peripheral circuit, and a lid having a projection and covering the IC socket. The lid fixes the IC package in such a manner that the printed board and the pins of the IC package are pressed in contact with each other between the electrical contacts of the IC socket and the projection of the lid with the pins of the IC package maintained in electrical contact with the lands of the printed board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.