Method of bonding polyimide films and printed circuit boards incorporating the same
US5176780A · kind A · utility
4Cited by
3References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 1991 |
| Grant date | Jan 5, 1993 |
| Priority date | — |
| Expiry date | May 20, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An adhesive having a content of a thermically curable oxazene resin which contains at least one 1-oxa-3-aza tetraline group in the molecule, optionally in combination with at least one curable epoxy compound, is used for bonding polyimide films to films of the same kind or to other substrates, particularly metal foils. Such bondings are highly heat-resistant and have an excellent peeling resistance. Therefore, they are suitable for the manufacture of printed circuit boards having high thermal stability and peeling resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.