Semiconductor substrate etching apparatus
US5176783A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 12, 1991 |
| Grant date | Jan 5, 1993 |
| Priority date | — |
| Expiry date | Sep 12, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor substrate etching apparatus for etching a tapered outer circumferential surface of a semiconductor substrate. A semiconductor substrate supply unit, an X-Y stage unit, an etchant applying unit, a cleaning unit, a baking unit, and a semiconductor substrate recovering unit are arranged in a horizontal plane in the described order. Semiconductor substrates are sequentially transferred by a transfer mechanism from the semiconductor substrate supply unit to the semiconductor substrate recovering unit in the described order. A control unit controls the transfer mechanism to perform the transferring of the semiconductor substrate, and controls the X-Y stage unit in response to a position detection signal, outputted from a position detector, for positioning the semiconductor substrate on the X-Y stage unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.