Gold plating bath additives for copper circuitization on polyimide printed circuit boards
US5176811A · kind A · utility
10Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 1991 |
| Grant date | Jan 5, 1993 |
| Priority date | — |
| Expiry date | Feb 1, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S205/926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method of fabricating a microelectronic package, especially a microelectronic package having gold plated copper circuitization on a polyimide substrate. The method includes the steps of forming a pattern of copper circuitization on the selected portions of the polyimide substrate, and thereafter depositing a gold thin film of selected portions of the copper circuitization layer. The gold thin film is electrodeposited from an electrodeposition solution of KAu(CN).sub.2, K.sub.2 HPO.sub.4, and KH.sub.2 PO.sub.4, modified by the addition of an effective amount of NH.sub.4.sup.+.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.