Room temperature curing composition
US5177131A · kind A · utility
4Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 1991 |
| Grant date | Jan 5, 1993 |
| Priority date | — |
| Expiry date | Jul 9, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S528/901
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The present room temperature curing composition comprises an organopolysilethylenesiloxane represented by the following general formula: ##STR1## wherein R.sup.1 to R.sup.4 each represent an alkyl having up to 8 carbon atoms or a phenyl group and n is an integer of 10 or above, and an organosilane or an organosiloxane having two or more hydrolyzable groups such as alkoxy groups in the molecule. The composition can form a cured product high in rubber strength and excellent in chemical resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.