Material for mold and process of forming mold by using this material
US5177140A · kind A · utility
5Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 1990 |
| Grant date | Jan 5, 1993 |
| Priority date | — |
| Expiry date | Apr 12, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22C1/2233
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A material for a mold which comprises, as main components, a refractory aggregate and a hardenable binder comprising a polyfunctional acrylamide having at least two ethylenically unsaturated groups in the molecule, has an excellent low-temperature rapid hardenability, disintegrability, and pot life and is especially suitable as a material for a mold for casting a low-melting-point metal such as an aluminum alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.