In situ RF shield for printed circuit board
US5177324A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 1991 |
| Grant date | Jan 5, 1993 |
| Priority date | — |
| Expiry date | Aug 19, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0715
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board providing RF shielding. An electrically insulating material serves as a substrate (10) with two opposed sides. At least one side of the substrate (10) has an electrically conductive layer (12) formed in a pattern that defines a printed circuit. An insulating dielectric layer (14) covers at least a portion of the printed circuitry, leaving at least one portion (16) of the circuitry exposed. A radio frequency (RF) shielding layer (18) is formed by depositing an electrically conductive polymer on at least a portion of the insulating dielectric layer. The RF shielding layer (18) also lies over a portion of the exposed electrical circuitry (16), providing electrical connection to the electrically conductive layer (12). The RF shielding layer (18) is formed from a silverfilled polymer thick film ink and is applied by screen printing, stencilling, roller coating, spraying, or other equivalent methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.