Aligning apparatus for substrate
US5177528A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 1992 |
| Grant date | Jan 5, 1993 |
| Priority date | — |
| Expiry date | May 26, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67259
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides an aligning apparatus which is capable of aligning auxiliary connecting plates such as a testing fixture plate so as to fit to both sides of a substrate. A camera 13a monitors aligning marks provided on a substrate 6 and a first auxiliary connecting plate (i.e. a lower surface testing fixture plate) 8 to carry out an aligning operation by moving the substrate 6 by means of an XY.THETA. table 5. A first plate-fitting member (a vacuum suction member) 32 fixes the substrate 6 and the first auxiliary connecting plate 8. On the other hand, a camera 13b monitors aligning marks provided on the substrate 6 and a second auxiliary connecting plate (i.e. an upper surface testing fixture plate) 11 to carry out an aligning operation by moving the second auxiliary connecting plate 11 by means of the XY.THETA. table 5. A second plate-fitting member (a vacuum suction member) 33 fixes the substrate 6 and the second auxiliary connecting plate 11. Thus, the auxiliary connecting plates can be accurately aligned on both sides of the substrate through one table.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.