Arrangement of an integrated circuit on a circuit board

US5177668A · kind A · utility

Assignee

• Diehl GmbH & Co. · DE

Inventors

• Armin Lederer · Schwarzenbruck, DE
• Jurgen Zimmermann · Salzgitter, DE

Key dates

• Filing date: May 18, 1992
• Grant date: Jan 5, 1993
• Expiry date: May 18, 2012

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15173
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Arrangement of a multi-layer through-contacting integrated circuit board with bonding-wires extending between chip contacts and substrate contacts, particularly designed for a compact circuit assembly of signal processors in an airborne body. The substrate contacts are arranged within a narrow connector strip extending parallel to the boundary of a chip-mounting region, and are in the plane of the substrate surface at approximately the same measurement and geometric sequence as the chip contacts of the circuit. Thin conductive paths extend and spread apart in a fan-like manner from the substrate contacts in an edge strip of the chip-mounting region, and terminate at mutually offset end surfaces of through-holes or vias which have a substantially larger cross-sectional area than the width of the thin conductive paths.