Method for forming a thin layer on a semiconductor substrate and apparatus therefor
US5178682A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 1991 |
| Grant date | Jan 12, 1993 |
| Priority date | — |
| Expiry date | Apr 18, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/28525
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for manufacturing a semiconductor device having a thin layer of material formed on a semiconductor substrate with a much improved interface between them are disclosed. A silicon substrate is heated up to a temperature around 300.degree. C. in the presence of ozone gas under exposure to UV light. Through this process, organic contaminants that might be present on the surface of the silicon substrate are dissipated by oxidation, and a thin oxide film is formed on the substrate surface on the other. The silicon substrate with the thin oxide film coated thereon is then heated up to temperatures of 200.degree.-700.degree. C. in the presence of HCl gas under illumination to UV light to strip the oxide film off the substrate surface, thereby exposing the cleaned substrate surface. Finally, HCl cleaned surface of the silicon substrate is coated with a thin layer of material such as monocrystalline silicon without exposing the cleaned substrate surface. The method provides a semiconductor with the thin layer of material formed thereon having a well-controlled, well organized interface between them.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.