Pretreatment process for electroless plating of polyimides
US5178956A · kind A · utility
5Cited by
14References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 3, 1989 |
| Grant date | Jan 12, 1993 |
| Priority date | — |
| Expiry date | Oct 3, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for promoting the adhesion of metal to thermoplastic substrates such as polyimides. The improvement comprises conditioning the substrate by treating with a lactone and aqueous rinse prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of the cohesive integrity of the substrate throughout subsequent processing steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.