Dihydroxybiphenyl-advanced epoxy resin blends
US5179139A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 1991 |
| Grant date | Jan 12, 1993 |
| Priority date | — |
| Expiry date | Sep 13, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31518
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition used as a matrix for a fiber-reinforced composite is disclosed, which comprises the following components: PA0 (A) a bifunctional epoxy resin; PA0 (B) at least one of a trifunctional epoxy resin and a tetrafunctional epoxy resin; PA0 (C) a dihydroxybiphenyl compound represented by the following general formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4, which may be the same or different, each represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; and PA0 (D) an aromatic amine, wherein said components (A), (B), (C) and (D) are used in amounts satisfying the following conditions: EQU 1/0.1.gtoreq.a/b.gtoreq.1/1.2 EQU 10/1.gtoreq.(a+b)/c.gtoreq.1/1 EQU 1/0.8.gtoreq.(a+b-c)/d.gtoreq.1/1.5 wherein a represents the molar number of epoxy groups in component (A), b represents the molar number of epoxy groups in component (B), c represents the molar number of phenolic OH groups in component (C) and d represents the molar number of NH groups in component (D).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.