Thermoplastic polypropylene/polyamide molding composition

US5179164A · kind A · utility

Assignee

• BASF SE

Inventors

• Dietrich Lausberg · Ludwigshafen, DE
• Erhard Seiler · Ludwigshafen, DE
• Christoph Plachetta · Schifferstadt, DE
• Hans-Georg Braun · Havelsee, DE
• Gerd Blinne · Worms, DE

Key dates

• Filing date: Mar 8, 1991
• Grant date: Jan 12, 1993
• Expiry date: Mar 8, 2011

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L2205/035
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Polypropylene/polyamide molding compositions, suitable in particular for producing moldings, advantageously consist of, in each case based on 100 parts by weight of the molding composition, PA0 A) from 10 to 89.5 parts by weight of one or more polypropylene homopolymers and/or copolymers, PA0 B) from 10 to 89.5 parts by weight of one or more polyamides, PA0 C) from 0.5 to 30 parts by weight of an ethylene copolymer as adhesion promoter, PA0 D) from 0 to 30 parts by weight of an impact modifier and PA0 E) from 0 to 60 parts by weight of a reinforcing agent and/or additive, the ethylene copolymer (C) advantageously being polymerized from, in each case based on (C), PA0 a) from 50 to 98% by weight of ethylene, PA0 b) from 1 to 45% by weight of one or more alkyl (meth)acrylates having 1 to 8 carbon atoms in the alkyl, but not tert-butyl (meth)acrylate, and PA0 c) from 1 to 40% by weight of one or more further monomers containing in bonded form a group which is reactive toward the polyamide, for example a carboxyl, carboxylic anhydride, tert-butyl carboxylate, sulfo, sulfonyl, oxazolinyl or epoxide group, and are produced by melting together components (A) to (C) and any (D) and/or (E) …