Laminated electronic module assembly
US5179501A · kind A · utility
127Cited by
17References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 1992 |
| Grant date | Jan 12, 1993 |
| Priority date | — |
| Expiry date | Feb 24, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/302
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic module assembly includes a relatively thin, bendable base plate having at least one bend axis along which the base plate is bent over on itself to provide an enclosure. An inner surface of the base plate supports at least one, and preferably two, relatively thicker metal plates, one on each side of the bend axis, each metal plate acting as a heatsink for circuit components mounted thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.