Method of manufacturing circuit structure by insert molding of electric and/or optical transmission medium
US5179601A · kind A · utility
18Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 1991 |
| Grant date | Jan 12, 1993 |
| Priority date | — |
| Expiry date | Oct 30, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/302
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a circuit structure where the electric and/or optical transmission medium or media include at least one of an optical signal transmission medium, an electric signal transmission medium, and an electric power transmission medium. The transmission media are insert-molded in plastics which is a housing for electronic and electric devices and parts. The circuit structure serves both for conductive circuits and housing so that the electronic and electric devices and parts can be wired and mounted at high density.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.