Printed circuit thermocouple arrangements for personnel training and equipment evaluation purposes
US5180440A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 8, 1992 |
| Grant date | Jan 19, 1993 |
| Priority date | — |
| Expiry date | Jan 8, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermocouple arrangement for developing, evaluating, monitoring and adjusting any process performed on or otherwise so as to thermally affect a printed circuit board assembly or other electronic assembly (including bare circuit board or boards in the manufacturing process), such as soldering/desoldering and various other production, rework and repair processes including cleaning, fluxing, preheating, thermocompression bonding and spot welding. In accordance with various embodiments, a layer of a first conductor material is applied on a first surface of an electrically insulative support, while a second layer of a second, dissimilar, conductor material is applied to at least one other surface of the support using conventional printed circuit board construction techniques. At those locations where thermocouple junctions are required, holes are drilled through the conductor layers and support material, and then the two layers of conductor are electrically connected by a plating of the first conductor material through the through hole. The voltages produced by the thermocouples during a production/repair/rework operation on an emulated electronic assembly may be monitored and used to…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.