Heat resistant adhesive composition
US5180627A · kind A · utility
13Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 1991 |
| Grant date | Jan 19, 1993 |
| Priority date | — |
| Expiry date | Dec 2, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The disclosed heat resistant adhesive composition comprises a polyimidesiloxane obtained from a biphenyltetracarboxylic acid or its derivative and a diamine composition comprising a diaminopolysiloxane and an aromatic diamine, an epoxy compound having an epoxy group, and an epoxy compound-hardening agent. An adhesive film and a composite sheet utilizing the heat resistant resinous composition are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.