Adhesive resin composition
US5180784A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 1992 |
| Grant date | Jan 19, 1993 |
| Priority date | — |
| Expiry date | Apr 16, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31913
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An adhesive resin composition is disclosed, comprising: (A) from 2 to 98% by weight of an ethylene copolymer comprising from 50 to 90% by weight of ethylene, from 0 to 49% by weight of an .alpha.,.beta.-unsaturated carboxylic acid alkyl ester, and from 0.5 to 10% by weight of maleic anhydride, with the sum of these monomers being 100% by weight; (B) from 2 to 98% by weight of a crystalline polyethylene resin comprising either an ethylene homopolymer or a copolymer of ethylene and an .alpha.-olefin having 3 or more carbon atoms, with an ethylene content being 90% by weight or more; and (C) from 2 to 50% by weight of a non-crystalline or low crystalline olefin copolymer rubber comprising a copolymer of ethylene and an .alpha.-olefin having 3 or more carbon atoms, with the sum of the components (A), (B) and (C) being 100% by weight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.