Membrane probe contact bump compliancy system
US5180977A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 2, 1991 |
| Grant date | Jan 19, 1993 |
| Priority date | — |
| Expiry date | Dec 2, 2011 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0735
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention provides a membrane probe contact bump compliancy system implemented in an integrated circuit (IC) testing system to nondestructively test a wafer. This integrated circuit system includes a test controller which is capable of controlling and executing a set of test programs, a wafer dispensing system, and a probe card. Under control of the test controller, the wafer dispensing system handles and controls the wafer for the performance of said set of test program. The probe card has a performance board and a plurality of probes. In cooperation with the wafer dispensing system, the probe card positions each of the probes to engage the wafer substantially at a predefined location with a controlled amount of force. The performance board further includes a transmission line corresponding to each probe. The probes are affixed to the performance board with each probe connected to a corresponding transmission line such that each probe is in electric communication with the test controller via the performance board. The probe card further includes a probe compliancy system disposed between the performance board and the probes. The compliancy system includes at least one …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.