Temperature stable solid-state laser package
US5181214A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1991 |
| Grant date | Jan 19, 1993 |
| Priority date | — |
| Expiry date | Nov 18, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/1317
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laser-diode or laser diode array end-pumped solid-state laser package for optical communications and the like mounted on a common thermally conductive, low thermal expansion base that is temperature stabilized with a thermo-electric cooler. The laser package includes a heat sink, a thermo-electric cooler mounted on the heat sink, a base having a base plate portion mounted on the thermo-electric cooler and a block portion mounted on the base plate portion and optical elements mounted on the base plate and block. The laser active medium and collimating and focusing lenses are mounted with their optically axes collinear in a v-groove formed in a top surface of the block. A laser diode pump is mounted to the base plate and supported so that its laser emission is aligned with the length of the groove. One cavity mirror is a curved reflective coating on an end of the active medium which is transparent to the laser diode pump light and reflective of the active medium generated laser light, while a second cavity mirror is a planar mirror mounted on the base plate. The optical system is aligned at an operating temperature at which the laser diode light's wavelength matches an absorbption …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.