Process for improving the adherency of metallic coatings deposited without current on plastic surfaces
US5182135A · kind A · utility
47Cited by
13References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 1991 |
| Grant date | Jan 26, 1993 |
| Priority date | — |
| Expiry date | Mar 18, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/387
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Activator formulations which contain an aromatic polyurethane as binder are highly suitable for the preparation of non-metallic substrate surfaces for currentless metallization. The metal coatings produced are distinguished by good adhesion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.