Laser methods for circuit repair on integrated circuits and substrates
US5182230A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 1988 |
| Grant date | Jan 26, 1993 |
| Priority date | — |
| Expiry date | Jul 25, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/173
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method of accessing and repairing electrical opens in conducting metal lines on a semiconductor chip or other substrate using laser plating techniques. What has been described is a maskless means of repairing discontinuities in a conductor disposed on the surface of a substrate wherein the surface is locally irradiated to form a reversible carbonaceous layer thereon. This reversible carbonaceous layer acts as a base for electrodeless deposition of a metal to form a bridge across the discontinuity by laser-enhanced exchange plating or other suitable methods. Further, a means of accessing and repairing a discontinuity buried by a cover layer of an insulating or passivating material is described, wherein access to the discontinuity is provided by ablating away the cover layer using a pulsed excimer laser at a first power level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.