Reversible production process for assembly of circuit board and substrate
US5182852A · kind A · utility
5Cited by
8References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 8, 1991 |
| Grant date | Feb 2, 1993 |
| Priority date | — |
| Expiry date | Nov 8, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
Production process for the reversible assembly of an electronic read and/or operating circuit board having a front face with conductive tracks and a rear face which is metallized and an electrically conductive or nonconductive support or substrate which may include metallized conductive tracks. The assembly is achieved by use of an electrically insulating silicone adhesive layer. A conductive foil is interposed between the rear face of the circuit board and the adhesive layer and is connected to a terminal in the support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.