Sputtering apparatus and system for sputtering employing same
US5183547A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 19, 1991 |
| Grant date | Feb 2, 1993 |
| Priority date | — |
| Expiry date | Apr 19, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/56
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a sputtering apparatus employed for producing an optical disc, for example, wherein a material to be processed by sputtering, such as a disc base plate, is placed in a vacuum chamber having an opening for entrance and exit of the material and a sputtering station, and is transported between the opening and the sputtering station by a rotary arm or arms, in such a manner as to simplify and reduce the size of the vacuum chamber and increase the production quantity per unit time. The present invention also provides an arrangement in which at least two of the sputtering apparatus are arranged in juxtaposition, and the sputtering operation is performed by one of the apparatus during the time when the sputtering operation is completed and the next sputtering operation is not started in the remaining apparatus, so that the equipment common to the respective sputtering apparatus, such as the sputtering power source, may be used so as to simplify the apparatus and increase the production quantity per unit time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.