Electroconductive adhesive comprising an epoxy novolak resin and phenol-aralkyl resin
US5183592A · kind A · utility
4Cited by
7References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 1991 |
| Grant date | Feb 2, 1993 |
| Priority date | — |
| Expiry date | Jan 9, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/22
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electroconductive adhesive comprising an epoxy-novolak resin, a phenol-aralkyl resin, a glycidyl group-containing silane coupling agent, an organic borate and an electro-conductive metal power is excellent in reliability in moisture and hydrolytic resistance and useful for semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.