Structurally-embedded electronics assembly
US5184141A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 5, 1990 |
| Grant date | Feb 2, 1993 |
| Priority date | — |
| Expiry date | Apr 5, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/42
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A structurally-embedded electronics assembly is disclosed and includes an outer skin member which is lightly loaded structurally, a primary load-carrying member positioned inboard from the outer skin member, a core member positioned between the primary load-carrying member and the outer skin member, an intermediate skin member positioned between the outer skin member and the core member and an electronics structure positioned between a predetermined two of the members or intermingled with a predetermined number of the members set forth above which are adjacent each other. In another embodiment, a thermally conductive baseplate member is positioned inboard from the primary load-carrying member. In another embodiment, a vibration damping member is positioned inboard from the primary load-carrying member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.