Method and apparatus for implementing engineering changes for integrated circuit module
US5184284A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 3, 1991 |
| Grant date | Feb 2, 1993 |
| Priority date | — |
| Expiry date | Sep 3, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10939
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Engineering changes (EC) for an integrated-circuit (IC) module or circuits connected to an IC module sometimes require the addition of discrete electrical components or circuit chips. Such engineering changes are implemented herein on a small printed circuit card or board that may be physically attached to the top of the IC module. The EC pads on the printed circuit EC card are juxtaposed with the IC module input/output (I/O) pins that require the engineering change. A short fly wire is then soldered between each juxtaposed EC pad and the I/O pin to make the electrical connection between the EC card and the module. In this way, no additional surface area is consumed on the printed circuit board on which the module is mounted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.