Socket constructed with molded-in lead frame providing means for installing additional component such as a chip capacitor
US5184285A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 1987 |
| Grant date | Feb 2, 1993 |
| Priority date | — |
| Expiry date | Nov 17, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A socket for connecting a first component to a circuit board. The socket includes pins for connection between the component and the board and a pair of lead frame regions, which are each electrically connected to at least one pin. Each of these regions includes a connection region for making connections to a second component. Insulative plastic is molded around the regions and defines holes through which the pins are inserted. A receptor opening is provided for receiving the second component. The first component may be an integrated circuit, the second a chip capacitor, and the socket may be a DIP socket. The capacitor may be soldered to the connection regions exposed through the receptor opening. Centering bumps may align the capacitor. The plastic may define an exposed area where each of the lead frame regions connects to respective pins, allowing for inspection of the connection between lead frame regions and respective pins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.