Method of forming a pattern on a surface
US5185055A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 1990 |
| Grant date | Feb 9, 1993 |
| Priority date | — |
| Expiry date | May 11, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14379
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The method of forming a pattern on a substrate is described which includes first applying a film of thermo plastic material under pressure to a substrate. Energy is then supplied to dissipate heat at the surface of the film facing the substrate thereby to bond the film to the substrate. Next, areas of the film are selectively dry etched to form a predetermined pattern on the substrate and this is followed by depositing on the substrate in the areas where the film has been dry etched, a layer of patterning material. Finally, dry removal from the substrate is effected of the film remaining thereon. There is also described the application of this method to the manufacture of an array, drop-on-demand ink jet printer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.