Circuit assembly encapsulated with polybutadiene urethane

US5185498A · kind A · utility

Assignees

• DELCO ELECTRONICS CORPORATION · US
• Hughes Aircraft Company · US

Inventors

• Henry M. Sanftleben · Carmel, US
• Ralph D. Hermansen · San Fernando, US
• Gary R. Shelton · Greentown, US
• Petrina L. Schnabel · Kokomo, US
• Dennis T. Baird · Kokomo, US
• Douglas C. Smith · Rumson, US

Key dates

• Filing date: Jun 11, 1991
• Grant date: Feb 9, 1993
• Expiry date: Jun 11, 2011

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31551
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

An acceleration sensor is packaged in an open can and encapsulated in an elastomeric polybutadiene compound which maintains its mechanical properties over a range of -40.degree. C. to 105.degree. C. and transmits acceleration to the sensor with a unity transfer function. The encapsulation material comprises about 90 to 100 pbw of polyol and about 20 pbw of isocyanate, the polyol consisting of at least 70% of hydroxy-polybutadiene. For enhanced adhesion a foaming agent and/or an epoxy is added to the mixture.