Electrostatic RF absorbant circuit carrier assembly and method for making the same
US5185654A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 1991 |
| Grant date | Feb 9, 1993 |
| Priority date | — |
| Expiry date | Nov 27, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic RF absorbant circuit carrier assembly (200) is described as having a plastic support structure (100) which consists of an integrally fashioned base (180) and surrounding sidewalls (170) which together form an internal cavity (185). A plurality of conductor paths (125,165) are disposed within the cavity (185). The assembly (200) is completed by a polymeric cover (110) having a surface integrally fashioned to comprise wall members (145) for making contact with conductive paths (165) within the cavity (185). In order to facilitate RF isolation and electrostatic dissipation, the cover (110) is layered with a surface material comprising: PA0 a thermosetting matrix system; PA0 a non-conductive RF absorbing filler comprising 25 to 87 percent by weight loading of the thermosetting matrix system; and PA0 a conductive filler comprising 1 to 4 percent by weight loading of the thermosetting matrix system and the RF absorbing filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.