Patent · US Expired

Transparent thermoplastic molding composition, process for its preparation and its use

US5187769A · kind A · utility

3Cited by

6References

7Claims

0Family size

Assignee

Hoechst GmbH · DE

Inventors

Werner Groh · Lich, DE
Rudolf Heumuller · Hong Kong, CN
Gerald Schutze · Hofheim, DE
Roland Stern · Wiesbaden, DE
Gerhard Wieners · Frankfurt am Main, DE

Key dates

Filing date	Feb 24, 1992
Grant date	Feb 16, 1993
Priority date	—
Expiry date	Feb 24, 2012

Classification

Technology area (CPC G)Physics
CPC primaryG02B1/045
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Transparent thermoplastic molding composition of a polymer containing PA1 a) 10 to 95% by weight of units which are derived from a compound of the formula (I) EQU R.sub.2.sup.1 C.dbd.CF--COO--C(CF.sub.3).sub.2 R.sup.2 (I) PA1 b) 90 to 5% by weight of units which are derived from one or more compounds of the formula (II) ##STR1## and c) 0 to 85% by weight of units which are derived from a compound of the formula (III) EQU R.sub.2.sup.7 C.dbd.CF--COO--CR.sub.3.sup.8 (III) The molding composition is used for the production of optical objects, in particular for the production of optical fibers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.