Electroconductive resin paste containing mixed epoxy resin and electroconductive metal powder
US5188767A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 1991 |
| Grant date | Feb 23, 1993 |
| Priority date | — |
| Expiry date | Apr 17, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electroconductive resin paste suitable for bonding a semiconductor element onto a substrate and exhibiting a superior adhesion strength and processability when heated to 200.degree. C. to 350.degree. C., and a process for producing a semiconductor device using the electroconductive resin paste are provided, which electroconductive resin paste comprises. PA1 (A) a mixed epoxy resin of a phenolic novolac type epoxy resin with an epi-bis type epoxy resin, PA1 (B) a phenolic novolac resin and/or phenol aralkyl resin, PA1 (C) organic borate, PA1 (D) a diluent containing a silane compound having one glycidyl group as at least one component therein, and PA1 (E) an electroconductive metal powder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.