Thermosensitive stencil paper
US5188881A · kind A · utility
8Cited by
4References
10Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 20, 1991 |
| Grant date | Feb 23, 1993 |
| Priority date | — |
| Expiry date | Jun 20, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/3192
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thermosensitive stencil paper is composed of a substrate and a thermoplastic resin film formed thereon, which thermoplastic resin film has projections in the surface portion thereof, with a printing roughness (R.sub.p) of 2.2 to 5.0 .mu.m, which is a physical quantity proportional to the average depth of the depressions in the surface portion thereof pressed against a standard surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.