Microwave radiation absorbing adhesive
US5189078A · kind A · utility
18Cited by
35References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 1989 |
| Grant date | Feb 23, 1993 |
| Priority date | — |
| Expiry date | Oct 18, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/54
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A microwave radiation absorbing adhesive comprises dissipative particles bound in a thermoplastic or thermosetting adhesive. The absorbing adhesive may be applied directly to the surface of any object, or to an irregularly shaped object, or into cracks or crevices in or between objects, including conventional absorbers. Several types of dissipative particles and adhesives may be used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.