Epoxy resin composition for encapsulating electric circuit components

US5189080A · kind A · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Klaus Heyke · Reutlingen, DE
• Richard Spitz · Reutlingen, DE
• Hans-Joachim Seidel · Waiblingen, DE
• Irene Jennrich · Winnenden, DE
• Werner Pfander · Fellbach, DE
• Armin Vohr · Reutlingen, DE

Key dates

• Filing date: Jan 31, 1992
• Grant date: Feb 23, 1993
• Expiry date: Jan 31, 2012

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08K3/36
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

An encapsulating resin composition for electrical and electronic components consists of cycloaliphatic epoxy resin, a hardener, an accelerator, a filler and, sometimes, a pigment. As a result of the combination of the cycloaliphatic epoxy resin with the provision of methylnadic anhydride as hardener and amporhous SiO.sub.2 as a filler, the material is capable of flowing at room temperature, is physiologically harmless and also otherwise well suited for mass production of a wide variety of electrical and electronic components, for example diodes and other semi-conductors for the motor vehicle industry. A small addition of hollow glass spherical particles counteracts sedimentation of amorphous SiO.sub.2 in pre-hardening storage of the resin.