Moisture-curable hot-melt adhesive compositions
US5189096A · kind A · utility
11Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 1990 |
| Grant date | Feb 23, 1993 |
| Priority date | — |
| Expiry date | Jan 19, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/26
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Novel crosslinkable hot-melt adhesive compositions, curable by atmospheric moisture, include (i) the prepolymerizate of an hydroxylated ethylene/vinyl acetate copolymer with a stoichiometric excess of a polyisocyanate, e.g., a diisocyanate, such prepolymerizate containing an effective crosslinkable amount of free isocyanate functional groups, and, optionally, (ii) an adhesive tackifying resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.