Patent · US Expired

Heat-resistant injection-moldable copolyester resins and resin blends of the same

US5189140A · kind A · utility

5Cited by
11References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 8, 1992
Grant dateFeb 23, 1993
Priority date
Expiry dateMay 8, 2012

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L67/02
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

A heat-resistant moldable copolyester resin is the copolymerization reaction product of a diol monomer component comprised mainly of 1,4-cyclohexanedimethanol, and an acid monomer component which includes first and second carboxylic acid comonomers. The first acid comonomer is a napthalenedicarboxylic acid or an ester-forming derivative thereof, while the second acid comonomer is 4,4'-diphenyldicarboxylic acid or an ester-forming derivative thereof. The first and second comonomers are present in amounts which satisfy the molar fraction ratio: EQU 3/7.ltoreq.A/B.ltoreq.8.5/1.5 wherein A and B are the molar fractions of the first and second acid comonomers, respectively.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.