Interconnection of electronic components
US5189507A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 1991 |
| Grant date | Feb 23, 1993 |
| Priority date | — |
| Expiry date | Jun 7, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides a technique for interconnecting electronic components in which interconnection wires are bonded to contacts on a first component without the use of a material other than the materials of the contacts and the wires; the wires are then severed to a desired length of between 2d and 20d, where d is the diameter of the wires, and bonded to contacts on the second component by means of a conductive material such as solder. Preferably, solder is provided as pools located in recesses in a layer of insulating material. The invention also provides a bonding head for a wire bonder for bonding the wire to the contact on the first component and for weakening or severing the wire at the desired point.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.